v10.0
水冷散热器可以以更小尺寸来设计制作，它能将热量很快传递出去而迅速降低温度，能显著提高电子产品寿命，适合于大功率电子产品。其特征如下：
l 小体积，大散热
l 适合所有IGBT模块
l 保持电子设备内温度一致
Liquid cooling offers the designer a significant advantage in reducing package size and increasing semiconductor life. The use of liquid cooling increases heat removal and decreases temperature rise due to the increased efficiency of the medium. Smaller, acoustically quieter, higher power output systems can be achieved.
§ Maximizes cooling in a compact package
§ Fits all standard IGBT module sizes
§ Maintains uniform temperature under devices
