SiliconPV 第一届国际硅太阳电池会议

SiliconPV, the 1st International Conference on Silicon Photovoltaics, will focus on the science and technology of crystalline silicon solar cells and modules. Since the progress of silicon photovoltaics is mainly technology-driven, SiliconPV will be an important forum for the international community. The special topic of the inaugural conference in 2011 will be “Advanced Cells and Modules”, one of the main drivers in silicon photovoltaics research and development.

An international committee comprised of well-known scientists from companies and institutes selected the best abstracts and formed a high-level scientific program. SiliconPV will feature inspiring invited talks, oral and poster presentations describing the most recent advances in the field, a platform for intensive discussions among experts and the adequate publication of the conference papers.

Program
Due to the very high quality of the submitted abstracts, the scientific committee was able to set up a high-class program. The conference program will be enriched by invited speakers who will shed light on challenging and trend-setting topics and will offer sufficient time for discussions.

Please click here to download the program overview!
Click here to download the preliminary program!

Important Dates
Deadline for Early Bird:
 28 Feb 2011
 
Paper upload opens:
 1 April 2011
 
End of online registration:
 6 April 2011
 

•Material aspects
(defects, carrier lifetime, doping type, mobility, …)
•Advanced characterization and simulation
(PL, EL, accurate measurement of back contact cells, carrier lifetime, simulation tools, quality assurance, inline measurements, …)
•Surface morphology and passivation
(texture, dielectric passivation layers, diffused layers, optical performance, …)
•Junction formation
(diffusion, amorphous hetero-junction, polysilicon, alloying, …)
•Structuring and contact formation
(laser, inkjet, fine-line printing, plating, paste and ink development, …)
•Process integration
(process sequences, production technology, process control, cost analysis, cell architecture, ...)
•Module integration
(back-contact-cell modules, adhesive conductors, soldering, system aspects, reliability testing, …)